| Job Description : |
How brave are you? We are a high-tech company providing machine tools and laser technology, and are looking for people who can face new challenges with a fresh mind. As an independent family company, we offer you the freedom and trust to put your brave ideas into practice. With you on board, we would like to power ahead with the digital networking of the manufacturing industry. Our passion and creative drive ensure that we are an innovative force – across the globe at over 70 TRUMPF locations.
Summary
Responsibility for change management, introduction of new technologies into production, improve existing technologies in production, introduction/improvement of testing/installation processes.
The primary responsibility of this position is the sustaining and development of III-V compound semiconductor fabrication processes for edge emitting lasers as well as ensuring manufacturing processes are robust and controlled. This position also mentors other process engineers in the technology behind the manufacturing processes and leads continuous improvement. Demonstrated knowledge and experience of wafer fab processing are essential.
Principle Duties & Responsibilities
The statements below are intended to describe the general nature and level of work in this position. They are not intended to be an exhaustive list of all responsibilities. The position may require that employees perform other duties as assigned.
Leads cross functional teams including external partners working on key Semiconductor Fab projects
Sustain and improve existing processes for manufacturability and high yield with emphasis in statistical process control (SPC)
Develop processes in the areas of photolithography, wet etch, dry etch, thin film deposition, platting and wafer thinning
Conduct data analysis, FMEA and SPC review for continuous process improvement
Write process specifications, work instruction and train technicians on proper adherence and implementation
Improve manufacturability and defect reduction for different process areas of the fab working closely with other process engineers
Experience
Extensive process and equipment experience in thin film deposition, wet and dry etch, plating, photolithography and wafer thinning
Hands-on experience in most of the above processes is required
Project management of technology projects
Strong problem solving and decision-making skills
Exceptional verbal and written communication skills
Excellent interpersonal skills and ability to communicate and interact with all levels of the organization in a matrix organization
Ability to use JMP software to create control charts and other SPC controls
Flexibility to support 24/5 manufacturing operations.
Education
The successful candidate will have either a Ph.D. degree with 8+ years industrial wafer fab experience or Master degree with 10+ years hands-on industrial wafer fab experience in electrical engineering, physics, materials science or other relevant subject. Bachelors on the above fields with 12+ years hands-on industrial wafer fab experience will also be considered.
TRUMPF is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability, veteran status, or other protected class. |
